Taiwan Industry Reports
Industry Type:   Title:  

Semiconductor Packaging and Testing US$ 100
Jun-2021 Doc #34703
Printed Page Length : 20 pages
Number of Tables : 4
Number of Figures: 2
Market Overview
Limited new production in the supply side, together with strong demand for restocking in the end-user markets, suggests the upward trend in the industry’s output value will persist in 2021, growing for the sixth consecutive year. However, logic integrated circuit testing and wire bonding will be subject to tight delivery.





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