Semiconductor Packaging and Testing
|
US$
75 |
Mar-2020 |
Doc #32305 |
|
Printed Page Length :
18
pages |
Number of Tables :
2 |
Number of Figures:
2 |
Market Overview
|
Demand for 5G-related hardware construction will spur the semiconductor packaging and testing industry (such as system in package, SiP, and antenna in package, AiP), suggesting that the output value of the industry will increase from 1.36 percent in 2019 to 4.00 percent in 2020.
|
|
|